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BGA Rework Services
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Reballing is the phrase that came out of the procedure where solder spheres/solder balls are replaced on the Integrated Component (IC) which has a Ball Grid Array (BGA).
How to use the service
1. Select the device and fault.
2. Print out packing/address label.
3. Deliver your device to our lab.
4. Wait till repair is completed.
5. Receive confirmation when done.
6. Pay by PayPal or Credit Card.
7. Track delivery status.
2. Print out packing/address label.
3. Deliver your device to our lab.
4. Wait till repair is completed.
5. Receive confirmation when done.
6. Pay by PayPal or Credit Card.
7. Track delivery status.